Hyundai Mobis and Qualcomm Join Hands for SDV and ADAS Systems

Hyundai Mobis and Qualcomm Technologies, Inc. announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next  generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems  (ADAS). The MOU signing, held at the Hyundai Mobis booth on the 00th (PST), was attended by Jung  Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul  Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm  Technologies, Inc.  

Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology.  

The companies will begin their work with their co‑development of advanced driving and parking  solutions based on the Snapdragon Ride™ Flex system-on-chip (SoC). These innovations will target  fast‑growing markets such as India, where ADAS adoption is expanding across vehicle segments  alongside rising demand for SDV‑ready architectures. For future SDV applications, they will also work  together on next‑generation integrated solutions that combine Hyundai Mobis’s standardized software  platform with Qualcomm Technologies’ Snapdragon® automotive technologies to enhance performance,  efficiency, and stability.