The seventh annual meeting of the Indo-German Working Group on Quality Infrastructure took place on 16th and 17th January 2020 in New Delhi with around 80 participants. Germany and India established the Working Group in 2013 to strengthen their economic and technical cooperation, reduce technical barriers to trade, and increase product safety. The German Federal Ministry for Economic Affairs & Energy (BMWi) and the Indian Ministry of Consumer Affairs, Food and Public Distribution in collaboration with other Ministries are working closely together on standardisation, accreditation and conformity assessment, metrology, product safety and market surveillance.
Director-General Stefan Schnorr of the German Federal Ministry for Economic Affairs and Energy: “Quality infrastructure is the language of international trade. With a growing relevance of technical regulations – such as mandatory standards – our exchange on regulatory approaches and compliance procedures eases doing business and boosts trade. I welcome the signing of our Work Plan 2020. We have agreed to intensify the cooperation on standards, technical regulation, certification, and market surveillance in key economic areas such as machinery safety, automotive, electric mobility and cybersecurity. A mutual understanding of requirements for safe and secure products helps to protect the citizens in both countries. Our Indo-German discussion paper on the cybersecurity of Internet of Things (IoT) devices which we just launched is a good example for our successful cooperation.”
Secretary, Consumer Affairs, ShriAvinash K. Srivastava said that “Germany is a trusted and important partner for India. It is encouraging to see the intense technical cooperation that happens in our bilateral Working Group. I am happy to see that we have deepened our cooperation in areas such as cybersecurity, market surveillance, Industry 4.0, and legal metrology. This year we will also put a focus on strengthening the dialogue on technical regulation, exchange on regulations of medical devices, and exploring twinning arrangements at ISO and IEC level.”